quick links

HERON Mk II Integration Flow Plan : https://drive.google.com/file/d/1GJQoydujsb0HBsDopRjCvGeFB-gQSBVG/view

Introduction

This document is meant as the one and final source of all assembly related information for HERON Mk. II. It is intended to make the assembly for the HERON Mk. II clear and known to more individuals beyond the shrinking remaining HERON mission members.

This document gathers and centralizes a vareity of documents, photos, and other resources that capture different aspects of assembly information to make them accessible and clear

There are 4 sections to this document:

  1. Key Resources - About the scattered resources used in HERON assembly with brief explanations of each. These resources are used in the rest of the guide.
  2. Spacecraft Components - outlines spacecraft components, where they are stored and other details.
  3. Handling and Facilities - Is information on spacecraft handling procedures, and the facilities involved in assembly.
  4. Assembly Process - Is about assembly itself, what the processs is, and the procedure(s) involved.

Acronyms and Vocabulary

Any acronyms or other uncommon words used in this document are captured in the table below, along with a brief description. If you come across a word you don't know while reading this guide, please add a new table row and one of the senior members will fill out the definition when they come across it. Acroynms may appear in externally linked resources that are not below. More acroynms and vocabular can be found in 1.2 of the Testing Guide.

Acronym/Word Definition Is this commonly used outside of UTAT?
BUS or BUS Stackup Not an acroynm. Used to describe all the core electronic components in a spacecraft, which are typically assembled together or close together. In the case of HERON, this is the following components: Antenna, batteries, transceiver, OBC, EPS. For HERON, all these components are stacked on top of each other, hence 'stackup.' The word may come from the term "serial bus" which is used to communicate data between any ICs Yes, this is a common industry term.
ESD Electrostatic discharge Yes

Contributors to this document

For the purposes of reaching out for further questions or clarification, this is the details of who has contributed to this doc. This also includes which active members of the team are intended to be made familiar with this doc

Creators

TO DOs pending for this doc

Anything in red text requires input and additions from people other than Eric